- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3215 - Doping the layers
Patent holdings for IPC class H01L 21/3215
Total number of patents in this class: 270
10-year publication summary
|
14
|
25
|
31
|
42
|
44
|
45
|
21
|
36
|
14
|
7
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
70 |
| International Business Machines Corporation | 60644 |
13 |
| Samsung Electronics Co., Ltd. | 131630 |
12 |
| SK Hynix Inc. | 11030 |
12 |
| Micron Technology, Inc. | 24960 |
11 |
| Texas Instruments Incorporated | 19376 |
10 |
| Applied Materials, Inc. | 16587 |
10 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
7 |
| Tessera LLC | 246 |
7 |
| Winbond Electronics Corp. | 1173 |
6 |
| Kioxia Corporation | 9847 |
6 |
| Daedalus Prime LLC | 110 |
6 |
| Intel Corporation | 45621 |
5 |
| Tokyo Electron Limited | 11599 |
5 |
| United Microelectronics Corp. | 3921 |
5 |
| Changxin Memory Technologies, Inc. | 4732 |
5 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1019 |
4 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
4 |
| Lodestar Licensing Group LLC | 583 |
4 |
| Varian Semiconductor Equipment Associates, Inc. | 1282 |
3 |
| Other owners | 65 |